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BSC022N04LSATMA1 - Infineon

Description: MOSFET N-Ch 40V 100A TDSON-8 OptiMOS 3

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BSC022N04LSATMA1 - Infineon - PCB symbol
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PCB Footprints
BSC022N04LSATMA1 - Infineon PCB footprint - Other - Other - PG-TDSON-8-5_1
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BSC022N04LSATMA1 - Infineon - 3D model - Other - PG-TDSON-8-5_1
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BSC022N04LSATMA1 Details

  • Manufacturer Part Number:

    BSC022N04LSATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TDSON-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    70 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    25 A

  • Drain-source On Resistance-Max:

    0.0032 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC022N04LSATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BSC022N04LSATMA1 is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current ratings specified in the datasheet, and ensure the device is operated within the recommended operating conditions.
  • For optimal thermal performance, use a multi-layer PCB with a thermal via structure, and ensure good thermal conductivity between the device and the heat sink. Follow the recommended PCB layout guidelines in the datasheet.
  • Follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and ensure the device is stored in an ESD-protected environment. The device has built-in ESD protection, but additional precautions are recommended.
  • Follow the recommended soldering conditions specified in the datasheet, including temperature, time, and flux type, to ensure reliable solder joints.

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BSC022N04LSATMA1 Overview

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