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BSC027N04LSGATMA1 - Infineon

Description: MOSFET N-Ch 40V 100A TDSON-8 OptiMOS 3

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BSC027N04LSGATMA1 - Infineon PCB footprint - Other - Other - BSC027N04LSGATMA1-1
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BSC027N04LSGATMA1 - Infineon  - 3D model - Other - BSC027N04LSGATMA1-1
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BSC027N04LSGATMA1 Details

  • Manufacturer Part Number:

    BSC027N04LSGATMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    GREEN, PLASTIC, TDSON-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    115 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    24 A

  • Drain-source On Resistance-Max:

    0.0041 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC027N04LSGATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BSC027N04LSGATMA1 is -55°C to 175°C.
  • To ensure proper biasing, the gate-source voltage (Vgs) should be between 4.5V and 10V, and the drain-source voltage (Vds) should be within the recommended operating range.
  • A good PCB layout should ensure minimal thermal resistance, use a thermal pad, and consider heat sinking. A thermal interface material (TIM) can also be used to improve heat transfer.
  • Handle the device by the body, use an ESD wrist strap or mat, and store the device in an anti-static bag or container to prevent ESD damage.
  • The maximum continuous drain current (ID) for the BSC027N04LSGATMA1 is 27A, and the maximum pulsed drain current (IDP) is 54A.

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BSC027N04LSGATMA1 Overview

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