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BSC059N04LS6ATMA1 - Infineon

Description: MOSFET N-Channel 40V 17A (Ta), 49A (Tc), 59A (Tc) 3W (Ta), 38W (Tc) Surface Mount PG-TDSON-8-6

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PCB Footprints
BSC059N04LS6ATMA1 - Infineon PCB footprint - Other - Other - TDSON-8 FL
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3D Models
BSC059N04LS6ATMA1 - Infineon  - 3D model - Other - TDSON-8 FL
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BSC059N04LS6ATMA1 Details

  • Manufacturer Part Number:

    BSC059N04LS6ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    10 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    49 A

  • Drain-source On Resistance-Max:

    0.0084 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    21 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    38 W

  • Pulsed Drain Current-Max (IDM):

    236 A

  • Reference Standard:

    IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC059N04LS6ATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for BSC059N04LS6ATMA1 is -40°C to 150°C.
  • Proper cooling can be achieved by using a heat sink, ensuring good airflow, and keeping the device away from other heat sources.
  • A recommended PCB layout for BSC059N04LS6ATMA1 includes a solid ground plane, short and wide traces, and a heat sink attached to the device.
  • Yes, BSC059N04LS6ATMA1 is suitable for high-reliability applications due to its robust design and manufacturing process.
  • Handle the device by the body, avoid touching the pins, and store it in an anti-static bag or container to prevent damage.

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