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BSC123N10LSGATMA1 - Infineon

Description: BSC123N10LSGATMA1 N-Channel MOSFET, 71 A, 100 V OptiMOS 2, 8-Pin TDSON Infineon

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Symbol
BSC123N10LSGATMA1 - Infineon - PCB symbol
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PCB Footprints
BSC123N10LSGATMA1 - Infineon PCB footprint - Other - Other - PG-TDSON-8_1
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3D Models
BSC123N10LSGATMA1 - Infineon - 3D model - Other - PG-TDSON-8_1
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BSC123N10LSGATMA1 Details

  • Manufacturer Part Number:

    BSC123N10LSGATMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    GREEN, PLASTIC, TDSON-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    155 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    10.6 A

  • Drain-source On Resistance-Max:

    0.0123 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    284 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC123N10LSGATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BSC123N10LSGATMA1 is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current ratings specified in the datasheet, and use a suitable voltage regulator and decoupling capacitors to minimize noise and voltage drops.
  • For optimal thermal performance, use a multi-layer PCB with a solid ground plane, and ensure good thermal conductivity between the device and the heat sink. Follow the recommended PCB layout guidelines in the datasheet and application notes.
  • Handle the device with ESD-protective equipment, such as wrist straps and mats, and ensure that the PCB is designed with ESD protection in mind, including the use of ESD-protection diodes and resistors.
  • Follow the recommended soldering temperature and time profiles specified in the datasheet, and use a soldering iron with a temperature-controlled tip. Ensure that the device is properly aligned and secured to the PCB during assembly.

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BSC123N10LSGATMA1 Overview

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