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BSH205G2AR - Nexperia

Description: NEXPERIA - BSH205G2AR - Power MOSFET, P Channel, 20 V, 2.6 A, 0.097 ohm, TO-236AB, Surface Mount

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PCB Footprints
BSH205G2AR - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23 Nexperia
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3D Models
BSH205G2AR - Nexperia  - 3D model - SOT23 (3-Pin) - SOT23 Nexperia
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BSH205G2AR Details

  • Manufacturer Part Number:

    BSH205G2AR

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.15

  • Avalanche Energy Rating (Eas):

    5 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    2.6 A

  • Drain-source On Resistance-Max:

    0.118 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    32 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    10 W

  • Pulsed Drain Current-Max (IDM):

    10 A

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSH205G2AR Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BSH205G2AR is a 0402 package with a land pattern of 0.5 mm x 0.3 mm. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • To prevent ESD damage, it's crucial to handle the BSH205G2AR with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that your workspace and tools are ESD-safe, and follow proper handling procedures.
  • The BSH205G2AR has an operating temperature range of -55°C to 150°C. However, it's essential to note that the device's performance and reliability may degrade if operated at extreme temperatures for extended periods.
  • Yes, the BSH205G2AR is suitable for high-reliability and automotive applications. It meets the AEC-Q101 qualification standard, ensuring it can withstand the harsh conditions found in these environments.
  • To ensure proper soldering, follow the recommended soldering profile, which includes a peak temperature of 260°C and a dwell time of 30-60 seconds. Use a solder with a melting point above 217°C, and ensure the PCB is designed with a suitable thermal relief pattern.

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BSH205G2AR Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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