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BSO604NS2XUMA1 - Infineon

Description: INFINEON - BSO604NS2XUMA1 - MOSFET, AEC-Q101, DUAL N-CH, SOIC-8

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BSO604NS2XUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-25
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BSO604NS2XUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-8-25
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BSO604NS2XUMA1 Details

  • Manufacturer Part Number:

    BSO604NS2XUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    90 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    5 A

  • Drain-source On Resistance-Max:

    0.044 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSO604NS2XUMA1 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and thermal management. This includes using a multi-layer PCB with a solid ground plane, placing the device near a heat sink or thermal pad, and ensuring good airflow around the device.
  • To ensure EMC, follow Infineon's guidelines for PCB layout, use a shielded enclosure, and implement proper filtering and shielding techniques. Additionally, ensure that the device is properly decoupled and that the PCB is designed to minimize electromagnetic radiation.
  • The BSO604NS2XUMA1 is designed to meet high reliability standards. According to Infineon, the device has a typical lifespan of 10-15 years, depending on operating conditions. However, this can vary depending on factors such as temperature, voltage, and usage patterns.
  • The BSO604NS2XUMA1 is rated for operation up to 150°C. However, it's essential to follow Infineon's guidelines for thermal management and derating to ensure reliable operation in high-temperature environments.
  • For troubleshooting and debugging, use Infineon's recommended tools and software, such as the Infineon Toolbox or other third-party tools. Additionally, consult the datasheet and application notes for guidance on debugging and troubleshooting common issues.

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BSO604NS2XUMA1 Overview

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