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BSO613SPVGXUMA1 - Infineon

Description: MOSFET TRENCH 40<-<100V

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BSO613SPVGXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - P-DSO-8-6
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BSO613SPVGXUMA1 Details

  • Manufacturer Part Number:

    BSO613SPVGXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    150 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    3.44 A

  • Drain-source On Resistance-Max:

    0.13 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    120 pF

  • JESD-30 Code:

    R-PDSO-G8

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    2.5 W

  • Pulsed Drain Current-Max (IDM):

    13.8 A

  • Reference Standard:

    AEC-Q101; IEC-61249-2-21; IEC-68-1

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    66 ns

  • Turn-on Time-Max (ton):

    31.5 ns

BSO613SPVGXUMA1 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and thermal management. This includes using a multi-layer PCB with a solid ground plane, placing thermal vias under the device, and using a heat sink with a thermal interface material. Additionally, ensure good airflow around the device and avoid thermal hotspots.
  • To ensure EMC and reduce EMI, follow Infineon's guidelines for PCB layout, component placement, and shielding. Use a shielded enclosure, and consider using EMI filters or common-mode chokes. Also, ensure proper grounding and decoupling of the device.
  • The BSO613SPVGXUMA1 is designed to operate in harsh environments. However, the reliability and durability expectations depend on various factors, including operating conditions, temperature, and humidity. Consult Infineon's reliability reports and environmental testing data to determine the device's performance in your specific application.
  • To troubleshoot and debug issues, use Infineon's recommended debugging tools and techniques, such as oscilloscopes and logic analyzers. Common failure modes include overheating, overvoltage, and electrical overstress. Consult Infineon's application notes and technical support resources for guidance on troubleshooting and debugging.
  • To prevent damage and ensure longevity, follow Infineon's recommended storage and handling procedures. Store the devices in their original packaging, away from direct sunlight and moisture. Handle the devices by the body, avoiding touching the pins or electrical contacts. Use anti-static wrist straps and mats to prevent electrostatic discharge.

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BSO613SPVGXUMA1 Overview

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