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BSP250,115 - Nexperia

Description: BSP250,115 P-Channel MOSFET, 3 A, 30 V, 4-Pin SOT-223 (SC-73) Nexperia

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BSP250,115 Details

  • Manufacturer Part Number:

    BSP250,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SC-73

  • Package Description:

    SC-73, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT223

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    3

  • Additional Feature:

    FAST SWITCHING

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    50 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    5 W

  • Pulsed Drain Current-Max (IDM):

    12 A

  • Reference Standard:

    IEC-134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    140 ns

  • Turn-on Time-Max (ton):

    80 ns

BSP250,115 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BSP250,115 is -55°C to 150°C.
  • To ensure reliability, follow Nexperia's recommended assembly and soldering guidelines, and ensure proper thermal management and PCB design.
  • Use a thermal pad on the PCB, and ensure good thermal conductivity between the device and the PCB. A minimum of 2 oz copper thickness is recommended.
  • Yes, the BSP250,115 is suitable for high-frequency applications up to 5 GHz. However, ensure proper PCB design and layout to minimize parasitic inductance and capacitance.
  • Ensure proper thermal management, and use a heat sink if necessary. Also, follow Nexperia's recommended assembly and soldering guidelines to prevent overheating.

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BSP250,115 Overview

Use the download button to access the BSP250,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BSP25, or try a keyword search, such as Power Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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