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BSP742RI - Infineon

Description: Power Switch ICs - Power Distribution SMART LW SIDE PWR 41V .4A

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BSP742RI - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-24_2023
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BSP742RI - Infineon  - 3D model - Small Outline Packages - PG-DSO-8-24_2023
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BSP742RI Details

  • Manufacturer Part Number:

    BSP742RI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    14

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.4 A

  • Output Peak Current Limit-Nom:

    1.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    34 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    170 µs

  • Turn-on Time:

    140 µs

  • Width:

    4 mm

BSP742RI Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 mm clearance around the device for heat dissipation.
  • Implement a thermal management system, such as a heat sink or thermal interface material, to keep the junction temperature below 150°C. Monitor the device's thermal resistance (RthJA) and ensure proper airflow.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering and hand soldering, as they can cause damage to the device.
  • Handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that all equipment and personnel are grounded. Implement ESD protection circuits in the design, such as TVS diodes or ESD protection arrays.
  • Store the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads.

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BSP742RI Overview

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Part Image BSP742R Infineon Technologies AG

Buffer/Inverter Based Peripheral Driver, 1 Driver, MOS, PDSO8