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BSP75NQTA - Diodes Incorporated

Description: Power Switch ICs - Power Distribution Low Side IntelliFET

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PCB Footprints
BSP75NQTA - Diodes Incorporated PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT223 (Type DN)
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3D Models
BSP75NQTA - Diodes Incorporated  - 3D model - SOT223 (3-Pin) - SOT223 (Type DN)
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BSP75NQTA Details

  • Manufacturer Part Number:

    BSP75NQTA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-223, 4 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Built-in Protections:

    OVER CURRENT; OVERLOAD; SHORT CIRCUIT; THERMAL; TRANSIENT

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G4

  • Length:

    6.5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    1.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    SOT-223

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Screening Level:

    AEC-Q101

  • Seated Height-Max:

    1.7 mm

  • Supply Current-Max:

    7 mA

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    75 V

  • Supply Voltage1-Min:

    60 V

  • Supply Voltage1-Nom:

    70 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    13 µs

  • Turn-on Time:

    3 µs

  • Width:

    3.5 mm

BSP75NQTA Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BSP75NQTA is a standard SOT23 package with a 1.5mm x 1.5mm pad size, with a thermal pad connected to the drain pin.
  • To ensure proper biasing, the gate-source voltage (Vgs) should be between 2V and 4V, and the drain-source voltage (Vds) should be between 10V and 30V, depending on the application requirements.
  • The maximum allowed power dissipation for the BSP75NQTA is 1.5W, and it is recommended to keep the junction temperature (Tj) below 150°C to ensure reliable operation.
  • Yes, the BSP75NQTA is suitable for high-frequency switching applications up to 100kHz, but it's essential to ensure proper PCB layout, decoupling, and thermal management to minimize losses and ensure reliable operation.
  • To protect the BSP75NQTA from ESD, it's recommended to handle the device with an anti-static wrist strap or mat, and to use ESD-protected equipment during assembly and testing.

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BSP75NQTA Overview

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