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BSP76 - Infineon

Description: Infineon BSP76, Analogue Switch

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PCB Footprints
BSP76 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - sot223
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3D Models
BSP76 - Infineon  - 3D model - SOT223 (3-Pin) - sot223
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BSP76 Details

  • Manufacturer Part Number:

    BSP76

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223

  • Package Description:

    GREEN, PLASTIC, SOT-223, 4 PIN

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    14

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    1.4 A

  • Output Peak Current Limit-Nom:

    7.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOT-223

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.8 mm

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    100 µs

  • Turn-on Time:

    100 µs

  • Width:

    3.5 mm

BSP76 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • The BSP76 requires a stable voltage supply of 5V ± 10% and a bias current of 10mA to 50mA. Ensure the voltage regulator is capable of providing a low noise and ripple-free output.
  • The BSP76 is rated for operation from -40°C to 125°C (junction temperature). However, for optimal performance and reliability, it is recommended to operate within -20°C to 85°C (ambient temperature).
  • Handle the BSP76 with ESD-safe materials and tools. Ensure the PCB has ESD protection diodes and resistors on the input/output lines. Ground the device during assembly and storage.
  • Store the BSP76 in a dry, cool place with a relative humidity of 50% or less. Avoid exposure to direct sunlight, moisture, and extreme temperatures.

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