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BSP772T - Infineon

Description: Infineon BSP772T Intelligent Power Switch, High Side, 3.1A, -10 → 16V 8-Pin, SOIC

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PCB Footprints
BSP772T - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-24
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3D Models
BSP772T - Infineon  - 3D model - Small Outline Packages - PG-DSO-8-24
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BSP772T Details

  • Manufacturer Part Number:

    BSP772T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    14

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    2.6 A

  • Output Peak Current Limit-Nom:

    3.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    34 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    230 µs

  • Turn-on Time:

    180 µs

  • Width:

    4 mm

BSP772T Frequently Asked Questions (FAQs)

  • Infineon recommends a 4-layer PCB with a solid ground plane, and to keep the high-frequency traces as short as possible. Additionally, a common mode choke can be used to filter out EMI.
  • The BSP772T has a thermal pad on the bottom of the package. Ensure good thermal contact with a heat sink or a thermal interface material. Also, provide adequate airflow around the device to prevent overheating.
  • The maximum allowed voltage on the input pins of the BSP772T is 5.5V. Exceeding this voltage may damage the device.
  • The BSP772T is rated for operation up to 150°C. However, the device's performance and reliability may degrade at high temperatures. Ensure proper cooling and derate the device's specifications accordingly.
  • Use an oscilloscope to check the input and output signals. Verify that the power supply voltage is within the recommended range. Check for proper PCB layout and decoupling. If issues persist, consult Infineon's application notes and technical support.

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