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BSZ067N06LS3G - Infineon

Description: 14 A, 60 V, 0.0121 ohm, N-CHANNEL, Si, POWER, MOSFET

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BSZ067N06LS3G - Infineon PCB footprint - Other - Other - BSZ067N06LS3G-2
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BSZ067N06LS3G - Infineon  - 3D model - Other - BSZ067N06LS3G-2
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BSZ067N06LS3G Details

  • Manufacturer Part Number:

    BSZ067N06LS3G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Pin Count:

    8

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    118 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    59 A

  • Drain-source On Resistance-Max:

    0.0121 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    32 pF

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    69 W

  • Pulsed Drain Current-Max (IDM):

    316 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-68-1; IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSZ067N06LS3G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BSZ067N06LS3G is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • To ensure proper biasing, follow the recommended operating conditions specified in the datasheet. This includes providing a stable voltage supply, using a suitable gate driver, and ensuring the device is operated within the recommended current and power limits.
  • When selecting a gate driver for the BSZ067N06LS3G, consider the following critical parameters: output current capability, rise and fall times, input voltage range, and compatibility with the device's gate-source voltage rating. Additionally, ensure the gate driver is capable of providing a high enough voltage to fully enhance the device.
  • For high-power applications, it's essential to implement proper thermal management to prevent overheating. This can be achieved by using a heat sink, ensuring good thermal contact between the device and the heat sink, and providing adequate airflow. Additionally, consider using a thermal interface material to reduce thermal resistance.
  • For optimal performance and reliability, follow these recommended PCB layout and design considerations: use a multi-layer PCB with a solid ground plane, keep the device's pins as short as possible, use a Kelvin connection for the source pin, and ensure proper decoupling and bypassing of the power supply.

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