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BTA12-600CWRG - STMicroelectronics

Description: 12 A Snubberless™, logic level and standard Triacs

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BTA12-600CWRG - STMicroelectronics - PCB symbol
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BTA12-600CWRG - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB Insulated
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BTA12-600CWRG - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AB Insulated
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BTA12-600CWRG Details

  • Manufacturer Part Number:

    BTA12-600CWRG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    500 V/us

  • DC Gate Trigger Current-Max:

    35 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    35 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    1 mA

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    12 A

  • Repetitive Peak Off-state Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Trigger Device Type:

    SNUBBERLESS TRIAC

BTA12-600CWRG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the tab of the device, and to use thermal vias to dissipate heat to the other side of the board. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device, and to ensure good thermal management through proper heat sinking and airflow. Additionally, consider using a thermocouple to monitor the device temperature.
  • Exceeding the maximum junction temperature can lead to a reduction in the device's lifespan, and in extreme cases, can cause permanent damage to the device. It is essential to ensure that the device operates within the recommended temperature range to ensure reliable operation.
  • To protect the device from electrical overstress (EOS), it is essential to follow proper handling and storage procedures, and to ensure that the device is not exposed to excessive voltage or current. Additionally, consider using protective devices such as TVS diodes or zener diodes to clamp voltage transients.
  • The recommended soldering conditions for this device are a peak temperature of 260°C, with a dwell time of 10-30 seconds. It is essential to follow the recommended soldering profile to prevent damage to the device.

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BTA12-600CWRG Overview

Use the download button to access the BTA12-600CWRG schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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