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BTA24-800CWRG - STMicroelectronics

Description: 800 V and 600 V, 25 A standard and Snubberless Triacs

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BTA24-800CWRG - STMicroelectronics - PCB symbol
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PCB Footprints
BTA24-800CWRG - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB Insulated
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3D Models
BTA24-800CWRG - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AB Insulated
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BTA24-800CWRG Details

  • Manufacturer Part Number:

    BTA24-800CWRG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Commutation Voltage-Min:

    13 V/us

  • Critical Rate of Rise of Off-State Voltage-Min:

    500 V/us

  • DC Gate Trigger Current-Max:

    35 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    50 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.005 mA

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    25 A

  • Reference Standard:

    UL RECOGNIZED

  • Repetitive Peak Off-state Voltage:

    800 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    SNUBBERLESS TRIAC

BTA24-800CWRG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a thermal via array can also help to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device, ensure good thermal management, and consider using a heat sink or thermal interface material to reduce the junction temperature.
  • The recommended soldering conditions for BTA24-800CWRG involve using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3 to 5 seconds. It's also essential to use a solder with a melting point above 217°C to prevent damage to the device.
  • To protect the device from electrical overstress (EOS), it's essential to follow the recommended operating conditions, use a suitable voltage regulator, and consider adding overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage from voltage spikes or current surges.
  • To prevent damage to the device, it's essential to store it in a dry, cool place, away from direct sunlight and moisture. Handling should be done with anti-static wrist straps or mats, and devices should be stored in anti-static bags or tubes to prevent electrostatic discharge (ESD) damage.

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BTA24-800CWRG Overview

Use the download button to access the BTA24-800CWRG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BTA24, or try a keyword search, such as TRIACs

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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