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BTB24-12W12D - Bellnix

Description: Isolated Module DC DC Converter 2 Output 12V -12V 125mA, 125mA 18V - 36V Input

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PCB Footprints
BTB24-12W12D - Bellnix PCB footprint - Other - Other - DIP 23.7*17.1*8.5mm
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3D Models
BTB24-12W12D - Bellnix  - 3D model - Other - DIP 23.7*17.1*8.5mm
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BTB24-12W12D Details

  • Manufacturer Part Number:

    BTB24-12W12D

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    ROHS COMPLIANT, METAL, DIP-11

  • ECCN Code:

    EAR99

  • Manufacturer:

    Bellnix Co Ltd

  • Additional Feature:

    OUTPUT VOLTAGE ALSO AVAILABLE IN +15 V AND -15 V, LG-MAX

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    18 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-MDMA-T11

  • Length:

    23.7 mm

  • Load Regulation-Max:

    5%

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    11

  • Output Voltage-Max:

    15 V

  • Output Voltage-Min:

    11.4 V

  • Output Voltage-Nom:

    12 V

  • Package Body Material:

    METAL

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    8.5 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    3 W

  • Trim/Adjustable Output:

    YES

  • Width:

    16.6 mm

BTB24-12W12D Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a large copper area for heat dissipation, and keeping the PCB layer stack-up symmetrical to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, provide adequate heat sinking, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The recommended soldering temperatures and times for the BTB24-12W12D are: peak temperature of 260°C (500°F), soldering time of 10 seconds, and a preheating time of 120 seconds to 150 seconds. It's essential to follow these guidelines to prevent damage to the device.
  • While the BTB24-12W12D is designed to operate in a variety of environments, it's not recommended for use in high-humidity environments without proper protection. Consider using conformal coating or potting to protect the device from moisture and ensure reliable operation.
  • To prevent damage and ensure reliable operation, it's essential to store the BTB24-12W12D in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or electrical connections, and use anti-static precautions to prevent ESD damage.

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BTB24-12W12D Overview

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