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BTS442E2E3062ABUMA1 - Infineon

Description: Current Limit Switch High Side

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PCB Footprints
BTS442E2E3062ABUMA1 - Infineon PCB footprint - Other - Other - PG-TO263-5-2
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3D Models
BTS442E2E3062ABUMA1 - Infineon  - 3D model - Other - PG-TO263-5-2
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BTS442E2E3062ABUMA1 Details

  • Manufacturer Part Number:

    BTS442E2E3062ABUMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SFM

  • Package Description:

    GREEN, PLASTIC, TO-220, 5 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1996-04-01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Output Current Flow Direction:

    SOURCE

  • Output Peak Current Limit-Nom:

    70 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-263

  • Package Equivalence Code:

    SMSIP5H,.6,67TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.5 mm

  • Supply Voltage-Max:

    42 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.7 mm

  • Terminal Position:

    SINGLE

  • Turn-off Time:

    130 µs

  • Turn-on Time:

    350 µs

  • Width:

    9.2 mm

BTS442E2E3062ABUMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BTS442E2E3062ABUMA1 is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and design, including using a solid ground plane, minimizing track lengths, and using decoupling capacitors.
  • To prevent ESD damage, it's essential to follow proper ESD handling procedures, such as using ESD-protective packaging, wrist straps, and mats, and ensuring that all equipment is properly grounded.
  • For reliable soldering and rework, it's recommended to follow Infineon's guidelines, including using a soldering iron with a temperature range of 220°C to 250°C, and using a solder with a melting point above 217°C.

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BTS442E2E3062ABUMA1 Overview

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