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BTS70081EPPXUMA1 - Infineon

Description: Power Switch ICs - Power Distribution

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BTS70081EPPXUMA1 Details

  • Manufacturer Part Number:

    BTS70081EPPXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-14

  • Country Of Origin:

    Austria, Germany, Indonesia, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES WITH EXTENDED SUPPLY FROM 3.1V TO 28V

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    11 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.15 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    220 µs

  • Turn-on Time:

    210 µs

  • Width:

    3.9 mm

BTS70081EPPXUMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BTS70081EPPXUMA1 is -40°C to 150°C.
  • To ensure reliability, it is recommended to follow the thermal design guidelines provided in the datasheet, and to consider using thermal interface materials and heat sinks to reduce the junction temperature.
  • The recommended PCB layout and design considerations for the BTS70081EPPXUMA1 include using a multi-layer PCB, placing decoupling capacitors close to the device, and minimizing the length of the power traces.
  • To troubleshoot issues with the BTS70081EPPXUMA1, check the power supply voltage, ensure proper thermal design, and verify that the device is operated within the recommended specifications. Also, check for any signs of physical damage or contamination.
  • Yes, it is recommended to follow proper ESD protection measures, such as using ESD-sensitive handling and storage procedures, and incorporating ESD protection devices in the PCB design.

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