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BTS711L1XUMA1 - Infineon

Description: INFINEON - BTS711L1XUMA1 - Power Load Switch, SIPMOS, High Side, Active High, 4 Outputs, -10 to +16V Input DC, 7.5A, SOP-20

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BTS711L1XUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-20-31
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BTS711L1XUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-20-31
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BTS711L1XUMA1 Details

  • Manufacturer Part Number:

    BTS711L1XUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Indonesia, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.15

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    4

  • Number of Terminals:

    20

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    4.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    34 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    400 µs

  • Turn-on Time:

    400 µs

  • Width:

    7.6 mm

BTS711L1XUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Use a shielded cable for the high-current paths, and ensure a good ground connection between the device and the PCB. Additionally, use a common-mode choke or a ferrite bead to filter out electromagnetic interference (EMI).
  • The maximum allowed voltage drop across the device is 0.5 V. Exceeding this value may lead to reduced performance, increased power dissipation, or even device failure.
  • Use a fuse or a current-limiting resistor in series with the device to prevent overcurrent conditions. For overvoltage protection, use a voltage regulator or a zener diode to clamp the voltage to a safe level.
  • The recommended operating temperature range is -40°C to 150°C. Operating the device outside this range may affect its performance, reliability, or lifespan.

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BTS711L1XUMA1 Overview

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