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BTT62004EMAXUMA1 - Infineon

Description: Smart High-Side 4-Ch Power Switch SSOP24

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PCB Footprints
BTT62004EMAXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-SSOP-24
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3D Models
BTT62004EMAXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-SSOP-24
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BTT62004EMAXUMA1 Details

  • Manufacturer Part Number:

    BTT62004EMAXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSSOP

  • Package Equivalence Code:

    SSOP24,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    28 V

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    150 µs

  • Turn-on Time:

    150 µs

  • Width:

    3.9 mm

BTT62004EMAXUMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BTT62004EMAXUMA1 is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended thermal design and layout guidelines, and to implement adequate cooling mechanisms to prevent overheating.
  • The recommended PCB layout and design considerations include using a multi-layer PCB, placing the device near the center of the board, and ensuring good thermal conductivity and heat dissipation.
  • To handle ESD protection, it's recommended to follow the standard ESD handling procedures, such as using ESD-safe materials, grounding straps, and wrist straps, and storing the devices in ESD-protective packaging.
  • The recommended soldering and assembly guidelines include using a soldering iron with a temperature range of 220°C to 250°C, and following the recommended soldering times and techniques to prevent damage to the device.

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BTT62004EMAXUMA1 Overview

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