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BTW69-800RG - STMicroelectronics

Description: SCR 800 V 50 A Standard Recovery Through Hole TOP3, 10 µA, 150 mA, -40°C ~ 125°C

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PCB Footprints
BTW69-800RG - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TOP3_2025
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3D Models
BTW69-800RG - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TOP3_2025
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BTW69-800RG Details

  • Manufacturer Part Number:

    BTW69-800RG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TOP3, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.43

  • Case Connection:

    ISOLATED

  • Circuit Commutated Turn-off Time-Nom:

    100 µs

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    250 V/us

  • DC Gate Trigger Current-Max:

    80 mA

  • DC Gate Trigger Voltage-Max:

    1.5 V

  • Holding Current-Max:

    150 mA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    200 mA

  • Non-Repetitive Pk On-state Cur:

    610 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    32000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    50 A

  • Reference Standard:

    UL RECOGNIZED

  • Repetitive Peak Off-state Leakage Current-Max:

    20 µA

  • Repetitive Peak Off-state Voltage:

    800 V

  • Repetitive Peak Reverse Voltage:

    800 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    SCR

BTW69-800RG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a large copper area for heat dissipation is recommended. Ensure good thermal conductivity by using thermal vias and a solid ground plane.
  • Implement a proper thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid overheating by monitoring the device's junction temperature.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage.
  • Use a dedicated gate driver IC or a high-current, low-impedance driver stage. Ensure a fast rise and fall time, and consider using a gate resistor to dampen oscillations.
  • Handle the device by the body, not the leads. Avoid touching the device's pins or exposed metal parts to prevent electrostatic discharge (ESD) damage.

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BTW69-800RG Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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