BU2032-1-HD-G footprint, schematic symbol and 3D model by Memory Protection Devices

Symbol

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PCB Footprints

BU2032-1-HD-G - Memory Protection Devices PCB footprint - Other - Other - BU2032-1-HD-G-2

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Datasheet Download Datasheet
Stock & Prices Price & Stock for BU2032-1-HD-G
Part Number BU2032-1-HD-G
Manufacturer Memory Protection Devices
Pin Count 3
Part Category Battery
Package Category Other
Footprint Name Other - BU2032-1-HD-G-2
Released Date Feb 7, 2024
Last Modified Date Feb 8, 2024 6:25 AM UTC
Pinout / Pin List Click Here (Member Only)

BU2032-1-HD-G Details

Manufacturer Part Number:
BU2032-1-HD-G
Rohs Code:
Yes
Part Life Cycle Code:
Contact Manufacturer
Package Description:
ROHS COMPLIANT
ECCN Code:
EAR99
HTS Code:
8536.69.40.40
Manufacturer:
Memory Protection Devices Inc (MPD)
Connector Type:
PCB CONNECTOR
Contact Finish Mating:
NOT SPECIFIED
Contact Material:
NOT SPECIFIED
DIN Conformance:
NO
Filter Feature:
NO
IEC Conformance:
NO
MIL Conformance:
NO
Mixed Contacts:
NO
Number Of Connectors:
ONE
Option:
GENERAL PURPOSE

BU2032-1-HD-G Frequently Asked Questions (FAQs)

The recommended storage condition for the BU2032-1-HD-G is in a cool, dry place with a temperature range of -40°C to 85°C and humidity below 80%.
Yes, the BU2032-1-HD-G is designed to withstand vibrations up to 10G, making it suitable for use in high-vibration environments.
The maximum soldering temperature for the BU2032-1-HD-G is 260°C for 10 seconds.
Yes, the BU2032-1-HD-G is compatible with lead-free soldering processes, making it suitable for use in RoHS-compliant applications.
The typical response time for the BU2032-1-HD-G is less than 1ms, making it suitable for use in applications requiring fast response times.

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BU2032-1-HD-G Overview

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