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BU4030BF-E2 - ROHM Semiconductor

Description: High Voltage CMOS LOGIC ICs <Logic Gate>

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BU4030BF-E2 - ROHM Semiconductor - PCB symbol
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PCB Footprints
BU4030BF-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP14
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BU4030BF-E2 - ROHM Semiconductor - 3D model - Small Outline Packages - SOP14
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BU4030BF-E2 Details

  • Manufacturer Part Number:

    BU4030BF-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    LSOP, SOP14,.25

  • Pin Count:

    14

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Family:

    4000/14000/40000

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e2

  • Length:

    8.7 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    XOR GATE

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR

  • Propagation Delay (tpd):

    90 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    16 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

BU4030BF-E2 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (Ta=-40°C to 125°C). Use a heat sink or thermal pad to keep the junction temperature (Tj) below 150°C. Monitor the device's thermal resistance (Rth) and adjust the PCB design accordingly.
  • ROHM recommends a 10uF to 22uF ceramic capacitor (X5R or X7R type) with a voltage rating of 10V or higher, placed as close as possible to the VIN pin to ensure stable operation and reduce noise.
  • Use a TVS diode or a zener diode to clamp the input voltage to a safe level. Add a fuse or a PTC thermistor to protect against overcurrent conditions. Ensure that the device is operated within the recommended voltage and current ratings.
  • ROHM recommends a 10uF to 22uF ceramic capacitor (X5R or X7R type) with a voltage rating of 5V or higher, placed as close as possible to the VOUT pin to ensure stable operation and reduce noise.

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BU4030BF-E2 Overview

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