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BU4053BCF-E2 - ROHM Semiconductor

Description: Multiplexer Switch ICs TRIPLE 2 CH ANALOG MULTIPLEXER

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PCB Footprints
BU4053BCF-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP16-25
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3D Models
BU4053BCF-E2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SOP16-25
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BU4053BCF-E2 Details

  • Manufacturer Part Number:

    BU4053BCF-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, SOP-16

  • Pin Count:

    16

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e2

  • Length:

    10 mm

  • Number of Channels:

    2

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • On-state Resistance Match-Nom:

    10 Ω

  • On-state Resistance-Max (Ron):

    950 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.71 mm

  • Supply Current-Max (Isup):

    0.015 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    550 ns

  • Switch-on Time-Max:

    550 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

BU4053BCF-E2 Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat dissipation measures are in place.
  • ROHM recommends a soldering temperature of 260°C (max) and a soldering time of 10 seconds (max) to prevent damage to the device.
  • Yes, the BU4053BCF-E2 is designed to operate in a humid environment. However, it is recommended to follow proper moisture sensitivity level (MSL) handling and storage procedures to prevent damage.
  • ROHM recommends using a ceramic capacitor with a value of 10uF to 22uF and a voltage rating of 50V or higher. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure stable operation.

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BU4053BCF-E2 Overview

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