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BU52015GUL-E2 - ROHM Semiconductor

Description: Board Mount Hall Effect / Magnetic Sensors 1.65-3.3V; +/-3.0mT Bipolar Detection

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BU52015GUL-E2 - ROHM Semiconductor - PCB symbol
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PCB Footprints
BU52015GUL-E2 - ROHM Semiconductor PCB footprint - BGA - BGA - VCSP50L1+
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3D Models
BU52015GUL-E2 - ROHM Semiconductor - 3D model - BGA - VCSP50L1+
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BU52015GUL-E2 Details

  • Manufacturer Part Number:

    BU52015GUL-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Additional Feature:

    DUAL OUTPUT, SEATED HEIGHT-MAX

  • Body Breadth:

    1.1 mm

  • Body Height:

    0.55 mm

  • Body Length or Diameter:

    1.1 mm

  • Hysteresis:

    0.9 mT

  • Magnetic Field Range-Max:

    5 mT

  • Magnetic Field Range-Min:

    0.6 mT

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    4

  • Operating Current-Max:

    0.012 mA

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 mA

  • Output Polarity:

    INVERTING

  • Output Range:

    0.20-1.60V

  • Output Type:

    VOLTAGE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    BGA4,2X2,20

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    MAGNETIC FIELD SENSOR,HALL EFFECT

  • Supply Voltage-Max:

    3.3 V

  • Supply Voltage-Min:

    1.65 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Termination Type:

    SOLDER

BU52015GUL-E2 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the IC for airflow and heat dissipation.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF) for power supply decoupling, and ensure the input voltage is within the recommended range (2.5V to 5.5V).
  • The maximum power dissipation is 1.5W. Ensure the device is operated within the recommended temperature range (-40°C to 85°C) and consider thermal design and heat sinking for high-power applications.
  • While the device is rated for operation up to 85°C, it's essential to consider the junction temperature (Tj) and ensure it does not exceed 150°C. Use thermal design and heat sinking to maintain a safe operating temperature.
  • Check the input voltage, output load, and decoupling capacitors. Verify the device is operated within the recommended specifications and consider using an oscilloscope to analyze the output voltage waveform.

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BU52015GUL-E2 Overview

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