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BU7255HFV-TR - ROHM Semiconductor

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BU7255HFV-TR - ROHM Semiconductor  - 3D model
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BU7255HFV-TR Details

  • Manufacturer Part Number:

    BU7255HFV-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOF

  • Package Description:

    ROHS COMPLIANT, HVSOF-5

  • Pin Count:

    5

  • Direct Group:

    AM0109800T2R

  • Similar Group:

    AM011001100412881256

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    40 dB

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    1.6 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    FL5/6,.047,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.6 mm

  • Slew Rate-Nom:

    3.4 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    4000

  • Voltage Gain-Min:

    1000

  • Wideband:

    NO

  • Width:

    1.2 mm

BU7255HFV-TR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • ROHM recommends following the derating guidelines in the datasheet, ensuring proper thermal design, and using a heat sink if necessary. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature.
  • Although the datasheet specifies the recommended operating voltage range, it's essential to note that the absolute maximum rating for the input pins is 7V. Exceeding this voltage may cause damage to the device.
  • Yes, the BU7255HFV-TR is suitable for high-frequency switching applications up to 100 kHz. However, it's crucial to consider the device's switching characteristics, such as rise and fall times, and ensure proper PCB layout to minimize parasitic inductance and capacitance.
  • ROHM recommends following standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation. Additionally, consider using ESD protection devices, such as TVS diodes, on the PCB to protect the BU7255HFV-TR from electrostatic discharge.

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BU7255HFV-TR Overview

Use the download button to access the BU7255HFV-TR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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