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BU7266FV-E2 - ROHM Semiconductor

Description: Low Power Input-Output Full Swing Operational Amplifier

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PCB Footprints
BU7266FV-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SSOP-B8
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3D Models
BU7266FV-E2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SSOP-B8
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BU7266FV-E2 Details

  • Manufacturer Part Number:

    BU7266FV-E2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Input Offset Voltage-Max:

    8500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.4 mm

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.35 mm

  • Slew Rate-Nom:

    2400 V/us

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3 mm

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This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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BU7266FV-E2 Overview

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