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BU7441G-TR - ROHM Semiconductor

Description: ROHM BU7441G-TR Op Amp, 0.6MHz CMOS, 3 V, 5 V, 5-Pin SSOP

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PCB Footprints
BU7441G-TR - ROHM Semiconductor PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SSOP5
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3D Models
BU7441G-TR - ROHM Semiconductor  - 3D model - SOT23 (5-Pin) - SSOP5
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BU7441G-TR Details

  • Manufacturer Part Number:

    BU7441G-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.25 mm

  • Slew Rate-Nom:

    0.3 V/us

  • Supply Current-Max:

    0.24 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    600

  • Voltage Gain-Min:

    3160

  • Wideband:

    NO

  • Width:

    1.6 mm

BU7441G-TR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure stable operation with a high-capacitance output capacitor, ROHM recommends adding a series resistor (Rs) between the output capacitor and the output pin to prevent oscillation. The value of Rs should be chosen based on the output capacitor value and the desired stability margin.
  • Although the datasheet doesn't specify a maximum voltage for the EN pin, ROHM recommends keeping the voltage on the EN pin within the VCC range (i.e., 2.5V to 5.5V) to ensure proper operation and prevent damage to the device.
  • While the BU7441G-TR is rated for operation up to 105°C, ROHM recommends derating the output current and power dissipation at high temperatures to ensure reliable operation. Consult ROHM's application notes for guidance on high-temperature operation.
  • To troubleshoot output voltage instability or oscillation issues, check the PCB layout for proper thermal design, ensure the output capacitor is properly sized and placed, and verify that the input voltage is within the recommended range. Also, check for any noise or ripple on the input voltage and ensure that the device is not overheating.

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