ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using thermal management techniques, such as heat sinks or fans, to keep the device temperature within the recommended range.
ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor (CIN). The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure stable operation.
To troubleshoot issues with the output voltage regulation, check the input voltage, output load, and feedback resistors (RFB1 and RFB2) for correct values and connections. Verify that the output capacitor (COUT) is properly sized and placed. Also, ensure that the device is operating within the recommended temperature range and that the PCB layout is optimized for thermal performance.
ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 47uF for the output capacitor (COUT). The capacitor should be placed as close to the VOUT pin as possible to minimize noise and ensure stable operation.
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