BUJ302AD - NXP

BUJ302AD Details

• Manufacturer Part Number:

  BUJ302AD

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Part Package Code:

  TO-252

• Package Description:

  PLASTIC, SC-63, DPAK-3

• Pin Count:

  3

• ECCN Code:

  EAR99

• HTS Code:

  8541.29.00.75

• Manufacturer:

  NXP Semiconductors

• Case Connection:

  COLLECTOR

• Collector Current-Max (IC):

  4 A

• Collector-Emitter Voltage-Max:

  400 V

• Configuration:

  SINGLE

• DC Current Gain-Min (hFE):

  25

• JEDEC-95 Code:

  TO-252

• JESD-30 Code:

  R-PSSO-G2

• JESD-609 Code:

  e3

• Moisture Sensitivity Level:

  1

• Number of Elements:

  1

• Number of Terminals:

  2

• Operating Temperature-Max:

  150 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Polarity/Channel Type:

  NPN

• Qualification Status:

  Not Qualified

• Surface Mount:

  YES

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Position:

  SINGLE

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Transistor Application:

  SWITCHING

• Transistor Element Material:

  SILICON