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BUK6Y61-60PX - Nexperia

Description: BUK6Y61-60P/SOT669/LFPAK

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PCB Footprints
BUK6Y61-60PX - Nexperia PCB footprint - Other - Other -  LFPAK56; Power-SO8 (SOT669)
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3D Models
BUK6Y61-60PX - Nexperia  - 3D model - Other -  LFPAK56; Power-SO8 (SOT669)
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BUK6Y61-60PX Details

  • Manufacturer Part Number:

    BUK6Y61-60PX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOT-669, SOP-8, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT669

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    61 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    25 A

  • Drain-source On Resistance-Max:

    0.061 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    49 pF

  • JEDEC-95 Code:

    MO-235

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    66 W

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BUK6Y61-60PX Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BUK6Y61-60PX is -40°C to 150°C.
  • To ensure reliability, follow proper PCB design and layout guidelines, use a suitable thermal management system, and ensure the device is operated within its recommended operating conditions.
  • The recommended soldering temperature profile for the BUK6Y61-60PX is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.
  • No, the BUK6Y61-60PX is rated for a maximum voltage of 600V. Using it in an application above 600V may result in device failure or reduced lifespan.
  • To protect the BUK6Y61-60PX from ESD, handle the device with an anti-static wrist strap or mat, and ensure the PCB is designed with ESD protection in mind.

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BUK6Y61-60PX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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