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BUK7880-55A/CUX - Nexperia

Description: MOSFET N-channel TrenchMOS standard level FET

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BUK7880-55A/CUX - Nexperia PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT223 (SC-73)
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BUK7880-55A/CUX - Nexperia  - 3D model - SOT223 (3-Pin) - SOT223 (SC-73)
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BUK7880-55A/CUX Details

  • Manufacturer Part Number:

    BUK7880-55A/CUX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-73

  • Package Description:

    SC-73, SOT-223, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT223

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    53 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    7 A

  • Drain-source On Resistance-Max:

    0.08 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    85 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    8 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BUK7880-55A/CUX Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BUK7880-55A/CUX is -40°C to 150°C.
  • To ensure proper cooling, use a heat sink with a thermal resistance of ≤ 10 K/W, and ensure good thermal contact between the device and heat sink. Additionally, consider using a thermal interface material to reduce thermal resistance.
  • To minimize EMI, use a multi-layer PCB with a solid ground plane, keep the device as close to the heat sink as possible, and use short, wide traces for the drain and source connections. Avoid using vias under the device and keep the PCB layout symmetrical.
  • Yes, the BUK7880-55A/CUX is suitable for high-reliability applications. Nexperia provides a range of qualification data and testing to ensure the device meets the requirements of these industries.
  • To protect the device from ESD, use an ESD wrist strap or mat, handle the device by the body or leads, and avoid touching the device's pins. Use ESD-sensitive packaging and storage materials, and consider using ESD protection devices in the circuit.

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BUK7880-55A/CUX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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