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BUK98150-55A - Nexperia

Description: FET, NXP, BUK98150-55A NXP BUK98150-55A N-channel MOSFET Transistor, 5.5 A, 55 V, 4-Pin SOT-223

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PCB Footprints
BUK98150-55A - Nexperia PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT223 (SC-73)
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BUK98150-55A - Nexperia  - 3D model - SOT223 (3-Pin) - SOT223 (SC-73)
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BUK98150-55A Details

  • Manufacturer Part Number:

    BUK98150-55A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-73, 4 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.4

  • Additional Feature:

    LOW CONDUCTION LOSS

  • Avalanche Energy Rating (Eas):

    22 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    5.5 A

  • Drain-source On Resistance-Max:

    0.161 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    55 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    8 W

  • Pulsed Drain Current-Max (IDM):

    22 A

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BUK98150-55A Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BUK98150-55A is -40°C to 150°C, as specified in the datasheet. However, it's recommended to derate the device's power handling capabilities at higher temperatures to ensure reliable operation.
  • To ensure proper cooling, follow the thermal design guidelines in the datasheet, including providing a sufficient heat sink, using thermal interface materials, and maintaining good airflow around the device. Additionally, consider using thermal simulation tools to optimize your design.
  • To minimize parasitic inductance and capacitance, follow the recommended PCB layout guidelines in the datasheet, including using a symmetrical layout, minimizing trace lengths, and using a solid ground plane. Additionally, consider using a 4-layer PCB with a dedicated power plane and a separate ground plane.
  • Yes, the BUK98150-55A is qualified for use in high-reliability and automotive applications, meeting the requirements of AEC-Q101 and other relevant industry standards. However, it's essential to follow the recommended design and testing guidelines to ensure the device meets the specific requirements of your application.
  • When testing and debugging the BUK98150-55A, ensure you follow proper safety procedures, including using appropriate personal protective equipment, such as safety glasses and gloves, and keeping the device at a safe distance from your body. Additionally, use a suitable test fixture and follow the recommended test procedures to avoid damaging the device or causing electrical shock.

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BUK98150-55A Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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