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BUK9K22-80EX - Nexperia

Description: NEXPERIA - BUK9K22-80EX - Dual MOSFET, N Channel, 80 V, 21 A, 0.0157 ohm, SOT-1205, Surface Mount

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BUK9K22-80EX - Nexperia PCB footprint - Other - Other - BUK9K22-80EX-2
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BUK9K22-80EX - Nexperia  - 3D model - Other - BUK9K22-80EX-2
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BUK9K22-80EX Details

  • Manufacturer Part Number:

    BUK9K22-80EX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT1205

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    116 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    21 A

  • Drain-source On Resistance-Max:

    0.0217 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    122 pF

  • JESD-30 Code:

    R-PDSO-X8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    64 W

  • Pulsed Drain Current-Max (IDM):

    84 A

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BUK9K22-80EX Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BUK9K22-80EX is -55°C to 175°C, as specified in the datasheet. However, it's recommended to derate the device's power dissipation above 150°C to ensure reliable operation.
  • To ensure proper cooling, it's essential to provide a sufficient heat sink and thermal interface material (TIM) between the device and the heat sink. The datasheet provides thermal resistance values, which can be used to calculate the required heat sink size and thermal interface material.
  • Nexperia provides a recommended PCB layout and footprint in the datasheet, which includes guidelines for pad sizes, spacing, and thermal vias. It's essential to follow these guidelines to ensure proper heat dissipation and to minimize electrical noise.
  • Yes, the BUK9K22-80EX is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured using a robust process that ensures high reliability and low defect rates.
  • The BUK9K22-80EX has built-in ESD protection, but it's still essential to follow proper handling and storage procedures to prevent ESD damage. This includes using ESD-safe materials, grounding straps, and minimizing handling during assembly.

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BUK9K22-80EX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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