BUK9Y19-75B,115 - Nexperia

BUK9Y19-75B,115 Details

• Manufacturer Part Number:

  BUK9Y19-75B,115

• Brand Name:

  Nexperia

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  SOIC

• Package Description:

  PLASTIC, LFPAK-4

• Pin Count:

  4

• Manufacturer Package Code:

  SOT669

• Country Of Origin:

  Philippines

• ECCN Code:

  EAR99

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  Nexperia

• YTEOL:

  5.3

• Additional Feature:

  LOW CONDUCTION LOSS

• Avalanche Energy Rating (Eas):

  121 mJ

• Case Connection:

  DRAIN

• Configuration:

  SINGLE WITH BUILT-IN DIODE

• DS Breakdown Voltage-Min:

  75 V

• Drain Current-Max (ID):

  48.2 A

• Drain-source On Resistance-Max:

  0.019 Ω

• FET Technology:

  METAL-OXIDE SEMICONDUCTOR

• Feedback Cap-Max (Crss):

  146 pF

• JEDEC-95 Code:

  MO-235

• JESD-30 Code:

  R-PSFM-T4

• JESD-609 Code:

  e3

• Moisture Sensitivity Level:

  1

• Number of Elements:

  1

• Number of Terminals:

  4

• Operating Mode:

  ENHANCEMENT MODE

• Operating Temperature-Max:

  175 °C

• Operating Temperature-Min:

  -55 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Shape:

  RECTANGULAR

• Package Style:

  FLANGE MOUNT

• Packing Method:

  TR, 7 INCH

• Peak Reflow Temperature (Cel):

  260

• Polarity/Channel Type:

  N-CHANNEL

• Power Dissipation-Max (Abs):

  106 W

• Pulsed Drain Current-Max (IDM):

  192 A

• Reference Standard:

  AEC-Q101; IEC-60134

• Surface Mount:

  NO

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  THROUGH-HOLE

• Terminal Position:

  SINGLE

• Time@Peak Reflow Temperature-Max (s):

  30

• Transistor Application:

  SWITCHING

• Transistor Element Material:

  SILICON