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BUZ31L - Infineon

Description: MOSFET N-CH 200V 13.5A TO220-3

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PCB Footprints
BUZ31L - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO220-3
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BUZ31L - Infineon  - 3D model - Transistor Outline, Vertical - TO220-3
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BUZ31L Details

  • Manufacturer Part Number:

    BUZ31L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    GREEN, PLASTIC, TO-220, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    200 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    13.5 A

  • Drain-source On Resistance-Max:

    0.2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    75 W

  • Pulsed Drain Current-Max (IDM):

    54 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BUZ31L Frequently Asked Questions (FAQs)

  • The BUZ31L can operate from -40°C to 150°C, but the maximum junction temperature (Tj) should not exceed 150°C.
  • The BUZ31L requires a minimum gate-source voltage (Vgs) of 4.5V to ensure proper biasing. Additionally, the gate-source voltage should be kept below the maximum rating of 10V to prevent damage.
  • To minimize parasitic inductance and capacitance, it is recommended to use a compact PCB layout with short leads and a solid ground plane. The source pin should be connected to the ground plane as close as possible to the device.
  • The BUZ31L is sensitive to ESD. To protect it, use ESD-safe handling and storage procedures, and consider adding ESD protection devices such as TVS diodes or ESD arrays to the PCB design.
  • The BUZ31L can handle a maximum current ripple of 10A, but it is recommended to keep the current ripple below 5A to ensure reliable operation and minimize losses.

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BUZ31L Overview

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