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BV1HL045EFJ-CE2 - ROHM Semiconductor

Description: BUILT-IN OUTPUT DIAGNOSIS 1CH HI

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BV1HL045EFJ-CE2 - ROHM Semiconductor - PCB symbol
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PCB Footprints
BV1HL045EFJ-CE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - HTSOP-J8-4
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3D Models
BV1HL045EFJ-CE2 - ROHM Semiconductor - 3D model - Small Outline Packages - HTSOP-J8-4
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BV1HL045EFJ-CE2 Details

  • Manufacturer Part Number:

    BV1HL045EFJ-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2020-04-03

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

BV1HL045EFJ-CE2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BV1HL045EFJ-CE2 is a 0402 package with a land pattern of 0.5mm x 0.3mm. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • To ensure reliability in high-temperature applications, it's crucial to follow the recommended derating curves for the BV1HL045EFJ-CE2. Additionally, consider using a thermal pad or heat sink to dissipate heat, and ensure good airflow around the component.
  • The maximum allowable voltage for the BV1HL045EFJ-CE2 is 45V. Exceeding this voltage may cause damage to the component or affect its reliability.
  • Yes, the BV1HL045EFJ-CE2 is suitable for high-frequency applications up to 100MHz. However, it's essential to consider the component's parasitic inductance and capacitance when designing the PCB layout.
  • To prevent damage during storage and shipping, it's recommended to store the BV1HL045EFJ-CE2 in its original packaging or an equivalent ESD-protective package. Avoid exposing the component to moisture, extreme temperatures, or physical stress.

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BV1HL045EFJ-CE2 Overview

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