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BV1LA025EFJ-CE2 - ROHM Semiconductor

Description: Power Switch ICs - Power Distribution AECQ

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BV1LA025EFJ-CE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - HTSOP-J8-4
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BV1LA025EFJ-CE2 - ROHM Semiconductor  - 3D model - Small Outline Packages - HTSOP-J8-4
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BV1LA025EFJ-CE2 Details

  • Manufacturer Part Number:

    BV1LA025EFJ-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    111 Weeks

  • Date Of Intro:

    2020-09-11

  • Manufacturer:

    ROHM Semiconductor

BV1LA025EFJ-CE2 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • ROHM recommends derating the voltage and current ratings according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat dissipation to prevent overheating.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s. Refer to the ROHM soldering guidelines for more information.
  • Yes, the BV1LA025EFJ-CE2 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions and design guidelines to meet the required reliability standards.
  • ROHM recommends following standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation, and ensuring that all equipment and tools are properly grounded. The BV1LA025EFJ-CE2 has an ESD rating of 2kV human body model (HBM).

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