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BV2HD070EFU-C - ROHM Semiconductor

Description: 2-ch high-side switch for automotive application. It has built-in over current protection function, thermal shutdown protection function, ...

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BV2HD070EFU-C - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - HSSOP-C16
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3D Models
BV2HD070EFU-C - ROHM Semiconductor  - 3D model - Small Outline Packages - HSSOP-C16
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BV2HD070EFU-C Details

  • Manufacturer Part Number:

    BV2HD070EFU-C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HSSOP-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP16,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    28 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    125 µs

  • Turn-on Time:

    175 µs

  • Width:

    3.9 mm

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