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BY500-600 - Diotec

Description: Diode 600V 5A Through Hole Axial , 5 µA , 5.4 x 7.5mm , -50°C ~ 175°C

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PCB Footprints
BY500-600 - Diotec PCB footprint - Other - Other - BY500-600-2
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3D Models
BY500-600 - Diotec  - 3D model - Other - BY500-600-2
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BY500-600 Details

  • Manufacturer Part Number:

    BY500-600

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    6.07

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    220 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Recovery Time-Max:

    0.2 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

BY500-600 Frequently Asked Questions (FAQs)

  • A good PCB layout for the BY500-600 should include a large copper area for heat dissipation, with multiple vias to the bottom layer for heat sinking. The component should be placed near a thermal pad or a heat sink to ensure efficient heat transfer.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves, ensure good thermal management, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal interface material to reduce thermal resistance.
  • The recommended soldering profile for the BY500-600 is a reflow soldering process with a peak temperature of 260°C (±5°C) and a dwell time of 20-30 seconds above 220°C. A slower ramp-up and ramp-down rate can help prevent thermal shock and ensure reliable solder joints.
  • While the BY500-600 is a robust component, it's essential to ensure that the PCB is properly secured and the component is adequately supported to withstand high-vibration environments. Consider using a vibration-resistant mounting method, such as a screw or clip, and ensure that the PCB is designed to minimize flexure and resonance.
  • To troubleshoot issues with the BY500-600, start by verifying the input voltage, current, and temperature. Check for signs of overheating, such as discoloration or deformation. Use a multimeter to measure the voltage and current at the input and output pins. If the issue persists, consult the datasheet and application notes or contact Diotec Semiconductor AG's technical support for further assistance.

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BY500-600 Overview

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