BYV26C - NXP

BYV26C Details

• Manufacturer Part Number:

  BYV26C

• Part Life Cycle Code:

  Obsolete

• Package Description:

  SOD-57, 2 PIN

• Pin Count:

  2

• ECCN Code:

  EAR99

• HTS Code:

  8541.10.00.80

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Additional Feature:

  LOW LEAKAGE CURRENT

• Application:

  FAST SOFT RECOVERY

• Breakdown Voltage-Min:

  700 V

• Case Connection:

  ISOLATED

• Configuration:

  SINGLE

• Diode Element Material:

  SILICON

• Diode Type:

  RECTIFIER DIODE

• Forward Voltage-Max (VF):

  2.5 V

• JESD-30 Code:

  E-LALF-W2

• Non-rep Pk Forward Current-Max:

  30 A

• Number of Elements:

  1

• Number of Phases:

  1

• Number of Terminals:

  2

• Operating Temperature-Max:

  175 °C

• Operating Temperature-Min:

  -65 °C

• Output Current-Max:

  0.65 A

• Package Body Material:

  GLASS

• Package Shape:

  ELLIPTICAL

• Package Style:

  LONG FORM

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Qualification Status:

  Not Qualified

• Reference Standard:

  IEC-134

• Rep Pk Reverse Voltage-Max:

  600 V

• Reverse Current-Max:

  5 µA

• Reverse Recovery Time-Max:

  0.03 µs

• Reverse Test Voltage:

  600 V

• Surface Mount:

  NO

• Technology:

  AVALANCHE

• Terminal Form:

  WIRE

• Terminal Position:

  AXIAL

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED