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BYW29-200G - onsemi

Description: Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Shipped 50 units per plastic tube; Marking: BYW29-200; Pb-Free Package is Available; Ultrafast 35 Nanosecond Recovery Time; 175 C Operating Junction Temperature; Popular TO-220 Package; Epoxy Meets UL94, VO @ 1/8''; Low Forward Voltage; Low Leakage Current; High Temperature Glass Passivated Junction Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 1.9 grams (approximately); Finish: All External Surfaces Corrosion Resistant and Term

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Symbol
BYW29-200G - onsemi - PCB symbol
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PCB Footprints
BYW29-200G - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 CASE221B-042
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3D Models
BYW29-200G - onsemi - 3D model - Transistor Outline, Vertical - TO-220 CASE221B-042
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BYW29-200G Details

  • Manufacturer Part Number:

    BYW29-200G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AC 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    221B-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.37

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

BYW29-200G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for BYW29-200G is to use a large copper pad with multiple vias to dissipate heat efficiently. The pad should be connected to a heat sink or a metal core PCB to further reduce thermal resistance.
  • To ensure reliability in high-temperature applications, it is essential to follow the recommended derating curves for BYW29-200G. Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow to keep the junction temperature within the recommended range.
  • The maximum allowable voltage transient for BYW29-200G is 400V. However, it is recommended to limit the voltage transient to 350V to ensure reliable operation and prevent damage to the device.
  • Yes, BYW29-200G can be used in a parallel configuration to increase current handling. However, it is essential to ensure that the devices are matched in terms of their electrical characteristics and that the current sharing is even to prevent overheating and reduce reliability.
  • The recommended gate drive voltage for BYW29-200G is between 10V and 15V. A higher gate drive voltage can reduce the turn-on time and improve the overall efficiency of the device.

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BYW29-200G Overview

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BYW29-200G Alternates

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For a full list of alternate parts for BYW29-200G, check out Findchips.com