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BYW80-200 - onsemi

Description: Rectifiers 200V 8A UltraFast

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PCB Footprints
BYW80-200 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−220 CASE 221B−04 ISSUE E
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BYW80-200 - onsemi  - 3D model - Transistor Outline, Vertical - TO−220 CASE 221B−04 ISSUE E
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BYW80-200 Details

  • Manufacturer Part Number:

    BYW80-200

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AC

  • Package Description:

    PLASTIC, CASE 221B-04, TO-220B, 2 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    CASE 221B-04

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e0

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

BYW80-200 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for BYW80-200 involves using a thermal pad on the bottom of the device, and connecting it to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a thermal interface material to further reduce thermal resistance.
  • To ensure reliable operation of BYW80-200 in high-temperature environments, it is essential to follow the recommended derating curves for voltage and current, and to ensure that the device is properly cooled. A maximum junction temperature of 150°C should not be exceeded, and the device should be operated within the recommended safe operating area (SOA).
  • The BYW80-200 has an internal ESD protection diode, but it is still recommended to follow proper ESD handling procedures during assembly and testing. The device should be handled in an ESD-controlled environment, and ESD-sensitive devices should be grounded before handling.
  • Yes, BYW80-200 can be used in switching applications, but it is essential to ensure that the device is operated within the recommended switching frequency and duty cycle. The device should not be operated at frequencies above 100 kHz, and the duty cycle should be limited to 50% or less to prevent overheating.
  • The gate resistor value for BYW80-200 should be selected based on the specific application requirements, including the switching frequency, voltage, and current. A general guideline is to use a gate resistor value between 10 ohms and 100 ohms, but the optimal value may need to be determined through experimentation and simulation.

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