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BYW80-200G - onsemi

Description: Ultrafast 35 Nanosecond Recovery Time; 175 C Operating Junction Temperature; Popular TO-220 Package; Epoxy Meets UL94, VO @ 1/8''; Low Forward Voltage; Low Leakage Current; High Temperature Glass Passivated Junction Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 1.9 grams (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Shipped 50 units per plastic tube; Marking: BYW80-

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PCB Footprints
BYW80-200G - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−220 CASE 221B−04 ISSUE E
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3D Models
BYW80-200G - onsemi  - 3D model - Transistor Outline, Vertical - TO−220 CASE 221B−04 ISSUE E
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BYW80-200G Details

  • Manufacturer Part Number:

    BYW80-200G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AC 2 LEAD

  • Package Description:

    LEAD FREE, PLASTIC, CASE 221B-04, TO-220B, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    221B-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    5.37

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

BYW80-200G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat. The copper area should be connected to a ground plane to reduce thermal resistance.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Use a heat sink or thermal interface material to reduce thermal resistance and prevent overheating.
  • A gate drive circuit with a high current capability (e.g., 1A) and a fast rise time (e.g., 10ns) is recommended to ensure reliable switching. A gate resistor (e.g., 10Ω) can be added to adjust the switching speed.
  • Use a voltage clamp or a transient voltage suppressor (TVS) to protect the device from overvoltage. Add a current sense resistor and a fuse or a current limiter to protect the device from overcurrent.
  • Store the device in a dry, cool place away from direct sunlight. Handle the device by the body, not the leads, to prevent damage. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage.

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BYW80-200G Overview

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