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BZA962AVL,115 - Nexperia

Description: BZA900AVL series - Quadruple low capacitance ESD suppressor

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PCB Footprints
BZA962AVL,115 - Nexperia PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT665_2022
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3D Models
BZA962AVL,115 - Nexperia  - 3D model - SO Transistor Flat Lead - SOT665_2022
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BZA962AVL,115 Details

  • Manufacturer Part Number:

    BZA962AVL,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT

  • Package Description:

    SOT-665, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT665

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.98

  • Breakdown Voltage-Max:

    6.51 V

  • Breakdown Voltage-Min:

    5.89 V

  • Breakdown Voltage-Nom:

    6.2 V

  • Configuration:

    COMMON ANODE, 4 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    6 W

  • Number of Elements:

    4

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.335 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134; IEC-61000-4-2; MIL-STD-883

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    4 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BZA962AVL,115 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package is recommended for heat dissipation. A copper pour on the PCB with multiple vias to the ground plane can help to reduce thermal resistance.
  • Ensure proper heat sinking, use a thermally conductive interface material, and consider derating the device's power handling at high temperatures (above 125°C).
  • Handle the device with ESD-protective equipment, and follow standard ESD handling procedures. The device has built-in ESD protection, but it's not a substitute for proper handling and storage.
  • Yes, the BZA962AVL,115 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that the device is used within its specified operating conditions and follow the recommended application guidelines.
  • Use a systematic approach to identify the issue, check the device's operating conditions, and verify the PCB layout and component selection. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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BZA962AVL,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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