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BZG03C150G - onsemi

Description: Standard Zener Breakdown Voltage − 15 V to 150 V; Peak Power 600 Watts @ 100 ms; ESD Rating of Class 3 (> 16 KV) per Human Body Model; Response Time is Typically < 1.0 ns; Flat Handling Surface for Accurate Placement; Package Design for Top Slide or Bottom Circuit Board Mounting

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BZG03C150G - onsemi - PCB symbol
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BZG03C150G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - BZG03C150G
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BZG03C150G Details

  • Manufacturer Part Number:

    BZG03C150G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.4

  • Breakdown Voltage-Max:

    156 V

  • Breakdown Voltage-Min:

    138 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    300 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    150 V

  • Rep Pk Reverse Voltage-Max:

    110 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    110 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    8%

  • Working Test Current:

    5 mA

BZG03C150G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement a thermal management system to keep the device temperature below the maximum rating. Monitor the device's thermal resistance (RthJA) and ensure it is within the specified range.
  • The BZG03C150G has an integrated ESD protection diode, but additional external protection may be required depending on the application. A minimum of 2 kV HBM (Human Body Model) and 200 V MM (Machine Model) protection is recommended.
  • Yes, the BZG03C150G is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it is essential to follow the recommended operating conditions and guidelines to ensure the device's reliability.
  • The BZG03C150G has a maximum power dissipation of 150 W. Ensure that the device is operated within the recommended power dissipation range. Implement a heat sink or thermal management system to dissipate heat, and monitor the device's temperature to prevent overheating.

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BZG03C150G Overview

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Part Image BZG03C150 onsemi

Zener Diode, 150V V(Z), 8%, 1.5W, Silicon, Unidirectional