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BZV55-C33,115 - NXP

Description: Zener Diode 33 V 500 mW ±5% Surface Mount LLDS; MiniMelf

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BZV55-C33,115 - NXP PCB footprint - Other - Other - BZV55-C33,115-1
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BZV55-C33,115 Details

  • Manufacturer Part Number:

    BZV55-C33,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    MELF

  • Package Description:

    HERMETIC SEALED, GLASS PACKAGE-2

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD80C

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    80 Ω

  • JESD-30 Code:

    O-LELF-R2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    200 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.4 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    33 V

  • Reverse Current-Max:

    0.05 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    WRAP AROUND

  • Terminal Position:

    END

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    33.4 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    2 mA

BZV55-C33,115 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for BZV55-C33,115 is -65°C to 175°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside the recommended temperature range.
  • To ensure proper biasing, follow the recommended voltage and current ratings specified in the datasheet. Typically, a voltage regulator or a resistive divider network is used to bias the Zener diode. Additionally, consider the device's power dissipation and thermal management to prevent overheating.
  • The maximum allowable power dissipation for BZV55-C33,115 is 500 mW, as specified in the datasheet. Exceeding this limit can lead to device failure or reduced lifespan. Ensure proper thermal management, such as using a heat sink or reducing the operating current, to stay within the recommended power dissipation limits.
  • While BZV55-C33,115 can be used as a voltage regulator, it's not the most suitable application. The device is primarily designed as a Zener diode for voltage stabilization and reference purposes. For voltage regulation, consider using a dedicated voltage regulator IC, such as the 78L05 or similar devices, which provide better performance, stability, and protection features.
  • To prevent electrostatic discharge (ESD) damage, follow proper handling and storage procedures. Use an ESD wrist strap or mat, and ensure the workspace is ESD-protected. When handling the device, avoid touching the pins or leads, and use an anti-static bag or tube for storage. Additionally, consider adding ESD protection components, such as TVS diodes, to the circuit design.

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BZV55-C33,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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