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BZX384-B10,115 - Nexperia

Description: Total power dissipation: ≤300 mW • Three tolerance series: ±1 %, ±2 % and approximately ±5 % • Working voltage range: nominal 2.4 V to 75 V (E24 range) • Non-repetitive peak reverse power dissipation: ≤ 40 W

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BZX384-B10,115 - Nexperia - PCB symbol
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PCB Footprints
BZX384-B10,115 - Nexperia PCB footprint - Small Outline Diode - Small Outline Diode - SOD323
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3D Models
BZX384-B10,115 - Nexperia - 3D model - Small Outline Diode - SOD323
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BZX384-B10,115 Details

  • Manufacturer Part Number:

    BZX384-B10,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    PLASTIC, SC-76, SOD-323, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    20 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    150 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    10 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    7 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    8 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX384-B10,115 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX384-B10,115 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask opening of 0.5 mm x 0.5 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a heat sink or thermal interface material (TIM) if the device will be operating at high temperatures or high currents. Also, ensure good airflow around the device.
  • The maximum allowable voltage derating for the BZX384-B10,115 is 10% of the nominal working voltage. For example, if the nominal working voltage is 10V, the maximum allowable voltage derating would be 1V.
  • Yes, the BZX384-B10,115 is suitable for high-reliability applications. It is manufactured using a high-reliability process and is qualified to AEC-Q101, which is a standard for automotive-grade components.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and use a solder with a melting point of 217°C to 221°C. Apply a small amount of solder to the pad, and use a soldering technique that minimizes the risk of overheating the component.

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BZX384-B10,115 Overview

Use the download button to access the BZX384-B10,115 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BZX38, or try a keyword search, such as Zener Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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