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BZX384-B18,115 - Nexperia

Description: Zener Diodes BZX384-B18/SOD323/SOD2

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PCB Footprints
BZX384-B18,115 - Nexperia PCB footprint - Small Outline Diode - Small Outline Diode - (SOD323/SC-76)-1
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3D Models
BZX384-B18,115 - Nexperia  - 3D model - Small Outline Diode - (SOD323/SC-76)-1
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BZX384-B18,115 Details

  • Manufacturer Part Number:

    BZX384-B18,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    PLASTIC, SC-76, SOD-323, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    45 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    225 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    18 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    12.6 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    16 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX384-B18,115 Frequently Asked Questions (FAQs)

  • The recommended land pattern for BZX384-B18,115 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.2 mm.
  • To handle the ESD sensitivity of BZX384-B18,115, it is recommended to use ESD protection devices, such as TVS diodes, and follow proper handling and storage procedures to prevent damage.
  • The maximum allowable power dissipation for BZX384-B18,115 is 500 mW, and it is recommended to derate the power dissipation based on the ambient temperature.
  • Yes, BZX384-B18,115 is suitable for high-reliability applications, but it is recommended to follow the recommended operating conditions and to perform thorough testing and validation to ensure the device meets the required reliability standards.
  • To ensure the long-term reliability of BZX384-B18,115, it is recommended to follow the recommended operating conditions, use a clean and dry environment, and avoid exposing the device to mechanical stress, moisture, or extreme temperatures.

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BZX384-B18,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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For a full list of alternate parts for BZX384-B18,115, check out Findchips.com