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BZX384-C3V9 - Nexperia

Description: BZX384-C3V9, Zener Diode, 3.9V /-5% 0.3 W 3??A, 2-Pin UMD

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BZX384-C3V9 - Nexperia - PCB symbol
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PCB Footprints
BZX384-C3V9 - Nexperia PCB footprint - Small Outline Diode - Small Outline Diode - SOD323 (SC-76)
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3D Models
BZX384-C3V9 - Nexperia - 3D model - Small Outline Diode - SOD323 (SC-76)
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BZX384-C3V9 Details

  • Manufacturer Part Number:

    BZX384-C3V9

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-323, 2 PIN

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    90 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    3.9 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX384-C3V9 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX384-C3V9 can be found in the Nexperia's SOT23 package outline drawing, which is available on the Nexperia website. The land pattern should be designed to minimize thermal resistance and ensure good solderability.
  • The BZX384-C3V9 is an ESD-sensitive device. To handle it safely, follow standard ESD precautions such as using an ESD wrist strap, ESD mat, or ESD-safe storage containers. Avoid touching the device's pins or handling it in a way that could generate static electricity.
  • The maximum allowable power dissipation for the BZX384-C3V9 is dependent on the ambient temperature and the thermal resistance of the device. According to the datasheet, the maximum power dissipation is 250 mW at an ambient temperature of 25°C. However, this value can be derated at higher temperatures. Consult the datasheet for more information.
  • The BZX384-C3V9 is a standard commercial-grade device, but Nexperia does offer AEC-Q101-qualified versions of the BZX384 series for automotive applications. For high-reliability applications, it's recommended to consult with Nexperia's sales team or a qualified distributor to determine the best option.
  • The BZX384-C3V9 has a voltage rating of 3.9 V. To determine the correct voltage rating for your application, consider the maximum voltage that will be applied to the device, including any voltage spikes or transients. Ensure that the voltage rating of the device is greater than or equal to the maximum voltage in your application.

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BZX384-C3V9 Overview

Use the download button to access the BZX384-C3V9 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BZX38, or try a keyword search, such as Zener Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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